Photosensitive element and its manufacturing method, method for manufacturing resist pattern and method for manufacturing conductor pattern

TW202642269APending Publication Date: 2026-10-16RESONAC CORP
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Patent Information

Application Number
TW115103558
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-07
Filing Date
2026-01-29
Publication Date
2026-10-16

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Abstract

A photosensitive element (10) comprises: a support film (12), a photosensitive resin film (14) disposed on the support film (12), and a protective film (16) disposed on the photosensitive resin film (14), wherein at least one of the support film (12) and the protective film (16) is a polypropylene film with an average thickness of 30 μm or more in contact with the photosensitive resin film (14), and the average thickness of the photosensitive resin film (14) is 80 μm or more.
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