Semiconductor devices, power modules and artificial intelligence computing systems
TW202642409APending Publication Date: 2026-10-16AOI ELECTRONICS CO LTD
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Patent Information
- Application Number
- TW115104184
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-13
- Filing Date
- 2026-02-03
- Publication Date
- 2026-10-16
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Abstract
This invention provides a semiconductor device, comprising: a semiconductor element; a first sealing portion sealing the semiconductor element; an inductor portion disposed above the first sealing portion and electrically connected to the semiconductor element; and a second sealing portion disposed above the first sealing portion and sealing the inductor portion, wherein the second sealing portion comprises a magnetic material. This invention also provides a power module having a semiconductor device. Furthermore, this invention provides an artificial intelligence computing system, comprising: a substrate; a power supply portion located above the substrate; an artificial intelligence semiconductor disposed above the substrate; and a power module that converts the voltage of the power supply portion into a voltage required by the artificial intelligence semiconductor.
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