Lower electrode assembly and its plasma treatment device

TW202642569APending Publication Date: 2026-10-16ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Application Number
TW114140433
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-30
Filing Date
2025-10-20
Publication Date
2026-10-16

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Abstract

A lower electrode assembly and its plasma processing apparatus are disclosed. The lower electrode assembly includes: a base, comprising: a substrate temperature control component and a radio frequency transmission layer wrapped around the outer surface of the substrate temperature control component; the substrate temperature control component has a cooling channel; the material of the substrate temperature control component has a first coefficient of thermal expansion; the material of the radio frequency transmission layer has a second coefficient of thermal expansion, the second coefficient of thermal expansion being greater than the first coefficient of thermal expansion, and the radio frequency transmission layer is a conductive material; and a ceramic layer disposed above the base for supporting the substrate. The lower electrode assembly, while satisfying radio frequency transmission and substrate temperature control, can reduce the possibility of damage to the lower electrode assembly.
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