RF connection components and semiconductor processing equipment

TW202642570APending Publication Date: 2026-10-16ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Application Number
TW114141516
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-30
Filing Date
2025-10-27
Publication Date
2026-10-16

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Abstract

This invention discloses a radio frequency (RF) connection assembly and a semiconductor processing apparatus. The RF connection assembly includes an RF guide rod, one end of which is provided with an elastic snap-fit ​​element, and the other end is electrically connected to an RF power supply. A conductive rod within a base handle is inserted into the elastic snap-fit ​​element and connected to the RF guide rod, allowing the RF power supply to feed RF energy through the RF guide rod to the conductive rod and the electrostatic chuck connected to the conductive rod. This invention ensures the stability of the connection between the RF guide rod and the conductive rod, enabling stable transmission of RF energy to the electrostatic chuck, thereby ensuring wafer fabrication efficiency and yield.
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