Method for forming conductive via structure and device thereof

Abstract

A method for forming conductive via structures and its device are provided. The method includes: providing a substrate having a plurality of holes which are arranged in a predetermined arrangement pattern; subsequently, adjusting a plurality of feeding components of a feeding module based on the predetermined arrangement pattern so that the plurality of feeding components respectively correspond to the plurality of holes of the substrate; then, supplying a plurality of conductive materials into the plurality of holes through the plurality of feeding components, and curing the plurality of conductive materials into a plurality of conductive via structures through a curing module. Thereby, the efficiency, flexibility and convenience of forming the conductive via structures can be improved.

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