Printed circuit board, bonded printed circuit board and printed circuit board assembly sheet

TW202642767APending Publication Date: 2026-10-16NITTO DENKO CORP
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Patent Information

Application Number
TW114144665
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-25
Filing Date
2025-11-17
Publication Date
2026-10-16

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Abstract

A wiring circuit board is bonded to another wiring circuit board and includes a laminated portion and a bonding portion. In the laminated portion, a first metal layer, an intermediate insulating layer, and a second metal layer are laminated. The bonding portion is connected to one of the first and second metal layers. The bonding portion can be bonded to the wiring circuit board. The thickness of the bonding portion is smaller than the thickness of the laminated portion. The thickness of the bonding portion is greater than the thickness of the metal layer connected to the bonding portion.
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