Conductive wiring structure and manufacturing method thereof

TW202642771APending Publication Date: 2026-10-16QING DING PRECISION ELECTRONICS HUAIAN CO LTD +2
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115125874
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-29
Publication Date
2026-10-16

Smart Images

  • Figure TWG2TA001081439_001
    Figure TWG2TA001081439_001
  • Figure TWG2TA001081439_002
    Figure TWG2TA001081439_002
  • Figure TWG2TA001081439_003
    Figure TWG2TA001081439_003
Patent Text Reader

Abstract

A conductive wiring structure includes an insulating layer and a conductive wire. The conductive wire is disposed on the surface of the insulating layer, and the cross-sectional shape of the conductive wire is semi-elliptical. The conductive wire has a thickness in the normal to the surface of the insulating layer, and a width in the direction perpendicular to the normal to the surface of the insulating layer, where the thickness is less than the width.
Need to check novelty before this filing date? Find Prior Art