Glass substrate capillary heat dissipation structure and forming method thereof

Abstract

A capillary heat dissipation structure of a glass substrate and a forming method thereof, wherein the glass substrate is subjected to the steps of A. preparing a damaged channel, B. forming a hollow tube portion, C. forming a coating, D. filling with a coolant, and E. closing the opening, etc., to form a plurality of hollow tube portions in the inner layer of the glass substrate, one end of the hollow tube portion is located below a chip arranged on the substrate, and the other end is located at the outer edge of the glass substrate, a coating of a porous material is formed on the hollow inner wall surface of each hollow tube portion, holes are distributed inside the coating to form a mesh structure, and a coolant is filled in the hollow tube portion, so that when the electronic component on the glass substrate is in operation, the capillary heat dissipation structure can be used to dissipate heat from the chip.

Description

[Technical Field]

[0001] This invention pertains to the creation of a glass substrate, particularly a glass substrate with a capillary heat dissipation structure. [Previous Technology]

[0002] Note that the operating speed of electronic components decreases as the ambient temperature rises during operation. Furthermore, prolonged operation at high temperatures reduces the reliability of electronic products, potentially degrading the chip's operational performance, efficiency, and reliability. Cooling systems used to maintain the chip at the desired operating temperature typically employ one or more heat dissipation devices (e.g., heat sinks, heat pipes, cold pipes, and radiators) to remove heat. These devices use conformal thermally conductive materials (TIMs), such as thermal paste, thermally conductive adhesives, and thermally conductive gap fillers, to thermally couple to the chip to facilitate heat transfer. However, the thermal resistance of the combined thermal interface material, and the thermal resistance at the interface boundary region, inhibits heat transfer from the chip to the heat dissipation device, thus adversely reducing the cooling efficiency of the cooling system. Secondly, while glass substrates are generally used in LCD screens, with technological advancements, they are increasingly being used as circuit boards for electronic components. The use of glass substrates also generates high temperatures due to the operation of electronic components; therefore, cooling the electronic components on glass substrates has become a focus for the inventors. In view of this, the inventor has conducted in-depth research on the aforementioned problems of conventional inventions and actively sought solutions. After long-term research and development, the inventor has finally successfully developed the invention "Glass Substrate Capillary Heat Dissipation Structure and its Molding Method" to improve the problems of conventional inventions. [Summary of the Invention]

[0003] The main objective of this invention is to provide a "capillary heat dissipation structure for a glass substrate and a method for forming the same", which enables the glass substrate to have a capillary heat dissipation structure, thereby improving the efficiency and quality of heat dissipation.

[0004] In order to achieve the above-mentioned creative purpose, the present invention, "Glass Substrate Capillary Heat Dissipation Structure and Forming Method thereof", forms a plurality of hollow tubes in the inner layer of a glass substrate. One end of each hollow tube is located below a wafer disposed on the glass substrate, and the other end is located at the outer edge of the glass substrate. A porous material coating is formed on the hollow inner wall of each hollow tube. The coating has pores distributed inside to form a mesh structure, and a coolant is filled inside the hollow tube. The process includes: A. Preparing damaged channels: A glass substrate is placed on a machine, and a femtosecond laser is used to form damaged channels inside the glass substrate, extending from the outer surface of the glass substrate towards the center; B. Forming hollow tubes: The glass substrate is placed in a container, and an etching solution in the container is used to etch the glass at the damaged channel location to form a hollow tube, with an opening on the outer surface of the hollow tube; C. Forming a coating: A porous material is deposited onto the inner wall of the hollow tube using plasma-assisted chemical vapor deposition (PECVD) equipment to form a coating, the coating containing pores forming a mesh structure; D. Filling with coolant: Coolant is filled into the hollow tubes using a filling device; E. Sealing the openings: The openings of the hollow tubes are sealed using silicone sealant. Therefore, when electronic components on the glass substrate are operating, the capillary heat dissipation structure can be used to dissipate heat from the chips and other electronic components, improving the heat dissipation efficiency and quality of the glass substrate. Regarding the technology, means, and effects of this invention, a preferred embodiment is described in detail below with reference to the accompanying drawings. It is believed that the above-mentioned objectives, structure, and features of this invention can be understood in depth and in detail from this description.

Implementation Method

[0005] Please refer to Figures 1 to 11. The present invention, ‘Glass Substrate Capillary Heat Dissipation Structure and Forming Method Thereof’, comprises a glass substrate (10). Using equipment such as a laser machine (20), etching equipment (30), plasma-assisted chemical vapor deposition (PECVD) equipment (40), and filling equipment (50), a plurality of hollow tubes (11) are formed inside the glass substrate (10). Then, a porous material coating (12) is formed on the hollow inner wall of each hollow tube (11), and a coolant (13) is filled into the hollow tube (11).

[0006] The glass substrate (10) is a general glass structure, on which electronic components (61) such as wafers can be placed, and conductive components (62) are embedded inside the corresponding electronic components (61).

[0007] This laser machine (20) is generally capable of generating femtosecond laser beams.

[0008] The etching equipment (30) is a device for holding etching solution in a general semiconductor container.

[0009] The plasma-assisted chemical vapor deposition (PECVD) equipment (40) is a technical equipment that utilizes the active groups and ions generated when the reactive gas is converted into plasma to form a thin film layer on the substrate surface.

[0010] The filling device (50) includes a filling chamber (51), a vacuum pump (52), a vacuum valve (53), a fluid filling valve (54), and a drain valve (55). The filling chamber (51) has an accommodating space (511) for the glass substrate (10) to be disposed, and a channel (512) adjacent to the periphery of the accommodating space (511). The vacuum pump (52) is connected to the filling chamber (51) via a first pipe (56). The vacuum valve (53) is located at an appropriate position on the first pipe (56) and can be used to fill the glass substrate (10). The filling chamber (51) is evacuated to create a negative pressure environment. A second pipe (57) and a third pipe (58) are connected to the outside of the filling chamber (51) at appropriate locations. A fluid filling valve (54) is located at an appropriate location on the second pipe (57), and the other end of the second pipe (57) is located at a fluid supply tank (59) to inject coolant (13) into the filling chamber (51). A drain valve (55) is located at an appropriate location on the third pipe (58) to discharge the coolant (13) from the filling chamber (51).

[0011] The process of forming the capillary heat dissipation structure of the glass substrate of the present invention includes:

[0012] A. To prepare a damaged channel, after positioning the glass substrate (10) on the laser machine (20), a damaged channel (14) is formed inside the glass substrate (10) using a laser head and an optical lens with femtosecond laser light. The damaged channel (14) extends from the outer edge of the glass substrate (10) toward the appropriate center.

[0013] B. Forming a hollow tube (11): The glass substrate (10) is placed in the container of the etching equipment (30), and the glass of the damaged channel (14) is etched by the etching solution in the container to form a hollow tube (11), and the hollow tube (11) is formed with an opening (111) on the outer side of the glass substrate (10).

[0014] C. Forming a coating (12): The glass substrate (10) is placed in the plasma-assisted chemical vapor deposition (PECVD) equipment (40) and plasma-assisted chemical vapor deposition is performed to deposit a porous material such as silicon oxide (SiOx) or silicon nitride (SiNx) onto the inner wall surface of the hollow tube (11) to form a coating (12). The coating (12) has pores distributed inside to form a mesh structure.

[0015] D. Filling with coolant (13): Place the glass substrate (10) in the receiving space (511) of the filling chamber (51), and after covering the cover, start the vacuum pump (52) to make the filling chamber (51) present a negative pressure. Then open the fluid filling valve (54) to deliver coolant to the filling chamber (51). The coolant (13) will flow into the channel (512) and the outer side of the forming opening (111) of the glass substrate (10). When the vacuum pump (52) stops working and the vacuum valve (53) remains open, the air pressure in the filling chamber (51) will gradually return to atmospheric pressure, but the hollow tube (11) will still remain in a vacuum state. Therefore, when the pressure in the filling chamber (51) returns to atmospheric pressure, the coolant (13) will be sucked into the hollow tube (11) to achieve the purpose of filling with coolant (13).

[0016] E. Close the opening (111). After the glass substrate (10) is removed, sealant (63) is applied to the opening (111) by hand or by applying glue equipment to close the opening (111) of the hollow tube (11). The sealant (63) can be glass glue or other glue.

[0017] Accordingly, by utilizing the capillary heat dissipation structure of the coating (12) and coolant (13) formed inside the glass substrate (10), the electronic components on the glass substrate (10) can dissipate heat from the chip and other electronic components during operation, thereby improving the heat dissipation efficiency and quality of the glass substrate. In summary, the present invention has excellent progressiveness and practicality among similar products. At the same time, a thorough search of domestic and foreign technical data and literature on this type of structure has not revealed any prior identical structure. Therefore, the present invention has the requirements for a novel patent, and an application is hereby filed in accordance with the law. The above embodiments are only used to illustrate the present invention. Various modifications, alterations and applications made by those skilled in the art without departing from the spirit of the present invention should be included in the scope of the present invention. [Simplified Explanation of the Diagram]

[0018] Figure 1: A perspective view of the present invention. Figure 2: A schematic diagram of step A, preparation of the damaged channel, of the present invention. Figure 3: A schematic diagram of step B, forming of the hollow tube, of the present invention. Figure 4: A schematic diagram of step C, forming of the coating, of the present invention. Figure 5: A cross-sectional view of the glass substrate after forming the coating, of the present invention. Figure 6: A structural diagram of the filling device of the present invention. Figure 7: An exploded view of the glass substrate placed in the filling chamber, of the present invention. Figure 8: An assembled cross-sectional view of the glass substrate placed in the filling chamber, of the present invention. Figure 9: A schematic diagram of the injection of coolant into the filling chamber, of the present invention. Figure 10: A schematic diagram of completing step D, filling with coolant, of the present invention. Figure 11: A schematic diagram of completing step E, closing the opening, of the present invention.

Claims

1. A capillary heat dissipation structure for a glass substrate, comprising a glass substrate on which a wafer can be disposed, characterized in that: the inner layer of the glass substrate is provided with a plurality of hollow tubes, one end of each hollow tube being located below the wafer and the other end being located at the outer edge of the glass substrate, and a porous material coating is formed on the hollow inner wall of each hollow tube, the coating having pores distributed inside to form a mesh structure, and a coolant being filled inside the hollow tube, thereby utilizing the capillary heat dissipation structure to dissipate heat from the wafer.

2. The capillary heat dissipation structure of the glass substrate according to claim 1, wherein the coating is formed by depositing a porous material on the inner wall surface of the hollow tube by plasma chemical vapor deposition (PECVD).

3. The capillary heat dissipation structure of the glass substrate according to claim 1 or 2, wherein the porous material may be silicon oxide (SiOx) or silicon nitride (SiNx).

4. A method for forming a capillary heat dissipation structure on a glass substrate, the process comprising: A. Preparing damaged channels: placing the glass substrate on a machine and forming damaged channels inside the glass substrate using femtosecond laser light, the damaged channels extending from the outer surface of the glass substrate towards a suitable center; B. Forming hollow tubes: placing the glass substrate in a container and etching the glass at the damaged channel location using an etching solution in the container to form hollow tubes, the hollow tubes having an opening at the outer surface of the glass substrate; C. Forming a coating: using plasma-assisted chemical vapor deposition (PECVD) equipment, depositing a porous material onto the inner wall of the hollow tubes to form a coating, the coating having pores distributed inside to form a mesh structure; D. Filling with coolant: using a filling device to fill the hollow tubes with coolant; E. Sealing the openings: applying sealing adhesive to the openings to seal the openings of the hollow tubes.

5. The method for forming a capillary heat dissipation structure on a glass substrate according to claim 4, wherein the porous material may be silicon oxide (SiOx) or silicon nitride (SiNx).

6. The method for forming a capillary heat dissipation structure on a glass substrate according to claim 4, wherein the coolant may be water or a refrigerant.

7. The glass substrate capillary heat dissipation structure forming method according to claim 4 of the patent application, wherein the filling equipment includes a vacuum pump, a vacuum valve, a filling chamber, a fluid filling valve, and a drain valve. The vacuum pump is connected to the filling chamber via a first pipe. The vacuum valve is located at an appropriate point on the first pipe to evacuate the filling chamber, creating a negative pressure state inside. A second pipe and a third pipe are connected at an appropriate point on the filling chamber. The fluid filling valve is located at an appropriate point on the second pipe. The other end of the second pipe is located in a fluid supply tank for injecting coolant into the filling chamber. The drain valve is located at an appropriate point on the third pipe for draining the filling chamber. The coolant inside is discharged outward. When the glass substrate is placed in the filling chamber, the vacuum pump is started to create a negative pressure in the filling chamber. Then, the fluid filling valve is opened to deliver the coolant to the filling chamber. There is a channel in the filling chamber, which is adjacent to the outer side of the glass substrate. The coolant will flow into the channel and the outer side of the opening of the hollow tube of the glass substrate. When the vacuum pump stops operating, the air pressure in the filling chamber will gradually return to atmospheric pressure, but the hollow tube will still maintain a vacuum state. Therefore, when the pressure in the filling chamber returns to atmospheric pressure, the coolant will be drawn into the hollow tube to achieve the purpose of filling with coolant.

8. The method for forming a capillary heat dissipation structure on a glass substrate according to claim 4, wherein the sealing adhesive may be glass glue.

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