Installation device and installation method

Abstract

A mounting apparatus and mounting method are provided for clamping a support substrate placed on a stage using a preferred clamp. According to one embodiment, the mounting apparatus for mounting electronic components onto a support substrate includes: a component supply unit for supplying the electronic components; a stage unit having a stage for placing the support substrate, a first clamp for clamping the support substrate placed on the stage, and a second clamp for clamping the support substrate placed on the stage; a transfer unit for transferring the electronic components supplied by the component supply unit; a mounting unit for mounting the electronic components transferred by the transfer unit onto the support substrate placed on the stage; and a control unit for controlling the operation of the mounting apparatus. The first clamp includes a surrounding portion that surrounds the outer periphery of a support member in plan view, and has an opening provided within the surrounding portion in plan view.

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