mounting device for electronic components

Abstract

The present invention addresses the application of an electronic component mounting apparatus and method, which enables precise mounting of electronic components onto a support substrate even when the support substrate is warped. One embodiment of the electronic component mounting apparatus is an apparatus for mounting electronic components onto a support substrate, comprising: a tray having one or more first openings; a stage for supporting the tray on which the support substrate is placed, having one or more openings communicating with one or more of the first openings, and movable at least in the horizontal direction; a support tool moved to a mounting position and supporting the support substrate via one or more of the openings of the stage and one or more of the first openings; and a mounting tool holding the electronic component and transporting it to the mounting position, and mounting it onto the support substrate supported by the support tool.

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