Transistor isolation structures and methods of formation

TW202642816APending Publication Date: 2026-10-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114120578
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-04
Filing Date
2025-06-02
Publication Date
2026-10-16

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Abstract

The present disclosure is directed to a method for fabricating spacer structures between source / drain (S / D) epitaxial structures and metal gate structures in nanostructure transistors. The method includes forming a fin structure with alternating first and second nanostructured layers on a substrate. The method also includes etching edge portions of the first nanostructured layers in the fin structure to form cavities and depositing a polymer spacer layer within the cavities to form inner spacers. The method further includes forming S / D epitaxial structures on the substrate to abut the fin structure and the inner spacers so that an air gap is formed between sidewall portions of the S / D epitaxial structures and the inner spacers.
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