Semiconductor structure, method of manufacturing semiconductor device, and noise-generator structure
TW202642835APending Publication Date: 2026-10-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114121121
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-09
- Filing Date
- 2025-06-05
- Publication Date
- 2026-10-16
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Abstract
A method, includes: forming a semiconductor structure including a plurality of nanostructures, a sacrificial gate structure, a source feature, and a drain feature; implanting ions in top and bottom surfaces of the plurality of nanostructures in channel regions of nanostructures; removing the sacrificial gate structure wherein a thickness of a nanostructure becomes uneven; and forming a replacement gate structure around the nanostructures, wherein a combination of an interfacial layer (IL) of the replacement gate structure surrounding the nanostructure and a high K dielectric layer of the replacement gate structure surrounding the nanostructure has an uneven thickness.
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