Sensor package structure and manufacturing method thereof

Abstract

The present invention provides a sensor package structure and a manufacturing method thereof. The sensor package structure includes a substrate, a light emitter assembled to the substrate, a receiver assembled to the substrate and spaced apart from the light emitter, two transparent bodies, and an encapsulant that is formed on the substrate. The light emitter has at least one light emitting region, and the receiver has at least one light receiving region. The two transparent bodies cover the at least one light emitting region and the at least one light receiving region, and respectively define a light output surface and a light input surface. The light emitter, the receiver, and the two transparent bodies are embedded in the encapsulant, and the light output surface and the light input surface of the two transparent bodies are exposed from a top surface of the encapsulant.

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