Lead frame and recess structures in light-emitting diode packages and related methods

Abstract

Light-emitting diode （LED） devices and more particularly lead frame and recess structures in LED packages and related methods are disclosed. Lead frame structures include leads embedded withing package housings and extending from housing top faces to housing bottom faces. One or more recesses are formed in housing top faces with shapes for providing targeted far field emission patterns. Exemplary shapes include elongated recesses, such as ovals, for tailored viewing angles. Related methods involve forming a single recess by successively drilling multiple overlapping holes along the housing top face. Lead frame structures and recess arrangements provide overall LED packages with reduced dimensions for arrangement in LED displays with reduced pixel pitch.

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