Semiconductor device arrangment

Abstract

A semiconductor device arrangement includes a carrier, an adhesive portion, and a semiconductor element. The adhesive portion is disposed on the carrier. The semiconductor element is disposed on the adhesive portion and includes semiconductor stacked layers, a protective layer, a first conductive layer, and a second conductive layer. The protective layer is disposed on the semiconductor stacked layers and has a first portion and a second portion. The first conductive layer is disposed on the semiconductor stacked layers. The second conductive layer is disposed on the first conductive layer. Wherein, the first portion is in contact with the adhesive portion. Wherein, the second portion is spaced apart from the adhesive portion.

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