Substrate bonding device

TW202642911APending Publication Date: 2026-10-16SCREEN HOLDINGS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115107328
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2015-12-28
Filing Date
2016-12-26
Publication Date
2026-10-16

Smart Images

  • Figure TWG2TA001081152_001
    Figure TWG2TA001081152_001
  • Figure TWG2TA001081152_002
    Figure TWG2TA001081152_002
  • Figure TWG2TA001081152_003
    Figure TWG2TA001081152_003
Patent Text Reader

Abstract

This invention improves substrate bonding production volume. The substrate bonding apparatus forms a contact area between a first substrate and a second substrate on a portion of the first substrate and the second substrate, and bonds the first substrate and the second substrate in such a way that the contact area expands from a portion, and includes: a detection unit for detecting information about the expansion state of the contact area; and a determination unit for determining whether the information detected by the detection unit meets specified conditions.
Need to check novelty before this filing date? Find Prior Art