Substrate processing apparatus, its operation method and substrate processing system

Abstract

This invention relates to a substrate processing apparatus and its operating method for providing uniformly distributed thermal energy to a target. One embodiment of the substrate processing apparatus may include: a stage for supporting a semiconductor substrate; and a laser for outputting laser light to the semiconductor substrate, the laser light provided to the semiconductor substrate having an M-shaped light distribution, and bonding the semiconductor substrate to a bare die disposed on the semiconductor substrate based on the thermal energy generated by the laser light provided to the semiconductor substrate.

Images