Metal deposition using pulsed voltage waveforms

Abstract

Embodiments of the disclosure include a processing chamber assembly that comprises: a chamber comprising a substrate-support assembly; a pulsed voltage generator comprising an output connection that is electrically coupled to a plurality of biasing electrodes embedded within the substrate-support assembly; and one or more chucking modules, wherein a chucking module of the one or more chucking modules comprises a direct-current voltage supply that is electrically coupled to one of the plurality of biasing electrodes through a corresponding bias compensation module that comprises a plurality of passive electrical components.

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