Manufacturing method of electronic device

TW202642935APending Publication Date: 2026-10-16MITSUI CHEM ICT MATERIA INC
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Patent Information

Application Number
TW115110682
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2026-03-20
Publication Date
2026-10-16

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Abstract

A manufacturing method of an electronic device comprises, in sequence: a step of preparing a structure P comprising, in this order, an electronic component, a surface protective film capable of being water-washable after at least one treatment selected from light irradiation and heating, and a backgrind tape; a BG step of backgrinding the side of the surface of the electronic component in the structure P opposite to the side of the surface protective film; a processing step of performing at least one treatment selected from light irradiation and heating on the surface protective film; and a protective film removal step of removing the surface protective film.
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