Semiconductor equipment

Abstract

This application discloses a semiconductor device, including a cavity, a substrate stage, a driving device, and a liquid spraying device. The cavity has a drain port; the substrate stage is located inside the cavity and is used to support the substrate; the driving device is located below the substrate stage and is used to drive the substrate stage to rotate; the liquid spraying device is configured to spray liquid and form a liquid film covering the drain port. This application uses the liquid spraying device to spray liquid to form a liquid film that covers the drain port, thereby blocking and dissolving waste gas overflowing from the drain port back into the cavity during the wet processing of the substrate. Simultaneously, the liquid dilutes the discharged processing liquid, reducing the evaporation of the processing liquid and mitigating the contamination of the substrate caused by overflowing waste gas.

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