Uv-assisted wafer cleaning method and apparatus

TW202642943APending Publication Date: 2026-10-16LAM RES AG
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Patent Information

Application Number
TW114147239
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-06
Filing Date
2025-12-03
Publication Date
2026-10-16

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Abstract

A method for removing post etch residue from the surface of a semiconductor wafer, comprising irradiating the patterned-side of the semiconductor wafer with ultraviolet radiation, the ultraviolet radiation having a wavelength of from
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