Substrate processing apparatus and substrate processing method

TW202642947APending Publication Date: 2026-10-16SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115105565
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2026-02-12
Publication Date
2026-10-16

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    Figure TWG2TA001081109_003
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Abstract

The substrate processing apparatus of the embodiment includes: a rotating holding section, including a holding section for holding a substrate, and a rotating body having an upper surface facing the lower surface of the substrate held by the holding section, wherein the substrate is rotated by rotating the holding section and the rotating body; a first gas supply section for supplying a first gas as a cooling gas to the space between the upper surface of the rotating body and the substrate held by the holding section; a first liquid supply section for supplying a first liquid to the substrate held by the holding section; and a second liquid supply section for supplying a second liquid with a temperature of 0°C or higher to the upper surface of the rotating body.
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