Wafer Cleaning Method and Apparatus

TW202642951APending Publication Date: 2026-10-16ACM RES (SHANGHAI) INC
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Patent Information

Application Number
TW115112807
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2026-03-31
Publication Date
2026-10-16

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Abstract

This disclosure provides a wafer cleaning method and apparatus. The wafer has a front side and a bevel adjacent to the front side. The method includes rotating the wafer, cleaning the bevel with an impurity cleaning solution until the bevel is clean, spraying an oxide solution onto the front side until an oxide film formed by the reaction of the oxide solution with the wafer completely covers the front side, and spraying a film-removing cleaning solution onto the front side to remove the oxide film. The wafer cleaning method and apparatus disclosed herein are capable of cleaning wafers thoroughly.
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