Joining device and joining method

Abstract

This invention provides a technique for improving the bonding quality of bare dies bonded to a target substrate. The bonding apparatus of this invention bonds a bare die to a target substrate. The bonding apparatus includes: a substrate platform for holding the target substrate; a first adsorption head for adsorbing the bare die; a first moving mechanism that, together with the first adsorption head, moves the bare die and presses it against the target substrate; and a gas discharge nozzle that, before the bare die begins to press against the target substrate, discharges a second gas with a water vapor concentration different from a first gas pre-present in the gap formed between the bare die and the target substrate.

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