Mounting devices and methods for electronic components

TW202642961APending Publication Date: 2026-10-16SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115112330
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2026-03-30
Publication Date
2026-10-16

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Abstract

The present invention addresses the application of an electronic component mounting apparatus and method that improves the replacement efficiency of a support substrate. One embodiment of the electronic component mounting apparatus is an apparatus for mounting multiple electronic components onto a support substrate, comprising multiple platforms capable of holding at least one of the support substrates and movable vertically offset from each other along the same path in a first direction, which is horizontal.
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