Multi-axis stage apparatus, wafer bonding method, and wafer bonding apparatus using the same

TW202642969APending Publication Date: 2026-10-16SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Application Number
TW114147174
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-11
Filing Date
2025-12-02
Publication Date
2026-10-16

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Abstract

The present application relates to a multi-axis stage apparatus, a wafer bonding method, and a wafer bonding system using the same. The multi-axis stage apparatus includes a base, an alignment stage configured to align a first wafer held by a first wafer chuck, a first driving device positioned between the base and the alignment stage and configured to vertically move the alignment stage with low precision, and a second driving device also positioned between the base and the alignment stage and configured to vertically move the alignment stage with high precision. The second driving device may include a flexure hinge, at least a portion of which is configured to distribute load.
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