Imaging device, mounting device for electronic components, and mounting method for electronic components.

TW202642971APending Publication Date: 2026-10-16SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115112416
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2026-03-30
Publication Date
2026-10-16

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Abstract

The present invention addresses the application of an imaging device, an electronic component mounting device, and a mounting method capable of accurately mounting electronic components onto a support substrate. One embodiment of the imaging device comprises: a prism for changing the imaging path; a first displacement meter for measuring a first displacement from a support substrate disposed below the imaging device via incident and reflected light through the prism; and an imaging element for simultaneously capturing and imaging images of an electronic component disposed above the imaging device and the support substrate via the prism, wherein the prism, the first displacement meter, and the imaging element are housed within a frame.
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