Parts mounting device and parts mounting method

Abstract

This invention provides a component mounting apparatus capable of suppressing large-scale manufacturing and improving productivity. One embodiment of the component mounting apparatus is characterized by comprising: a component supply unit 10 for supplying electronic components; a stage 20 for holding at least one support substrate W for mounting electronic components; a plurality of transfer units 30A and 30B for removing electronic components from the component supply unit 10; and a plurality of mounting heads 40A and 40B arranged in a first direction, each of the plurality of mounting heads 40A and 40B moving in a second direction orthogonal to the first direction to simultaneously mount electronic components received from the plurality of transfer units 30A and 30B onto the support substrate W.

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