Glass substrate inspection system

Abstract

The present invention provides a glass substrate inspection system suitable for inspecting glass substrates before the perforation process. By using the technical features of each sub-component disclosed by the glass substrate inspection system, the reliability of subsequent processes for inspecting glass substrates before the perforation process can be greatly improved, which is different from the traditional microscope inspection method mentioned in the prior art.

Description

Technical Field

[0001] The present invention is related to glass inspection technology, and in particular to a system suitable for inspecting glass substrates before perforation. Prior Art

[0002] Currently, inspection of pre-TGV (Through Glass Via) glass substrates prior to the perforation process (pre-TGV) is typically performed on the glass substrates after the perforation process. However, this conventional inspection method uses a traditional microscope. This significantly reduces measurement reliability of pre-TGV glass substrates, thereby affecting the yield of subsequent processes. Furthermore, incomplete penetration is often detected, causing significant inconvenience to inspection personnel.

[0003] Therefore, how to effectively improve the inspection yield of glass substrates before the perforation process (Pre-TGV, Through Glass Via) is actually an urgent goal of the present invention. Summary of the Invention

[0004] To address the problems described in the prior art, the present invention provides a glass substrate inspection system suitable for inspecting pre-TGV (Through Glass Via) glass substrates before the perforation process. By utilizing the technical features of the various subcomponents disclosed in this glass substrate inspection system, the system significantly improves the reliability of subsequent processes for inspecting pre-TGV glass substrates, unlike the traditional microscope inspection methods mentioned in the prior art.

[0005] To achieve the above-mentioned objectives, the present invention provides a glass substrate inspection system, comprising a microprocessor unit, a carrier unit, a first inspection device, and a second inspection device; the microprocessor unit, the first inspection device, and the second inspection device are individually assembled on the carrier unit, and the carrier unit is provided with a backlight module and a backlight module polarizer matching the backlight module; wherein the microprocessor unit is individually electrically connected to and electrically controls the carrier unit, the first inspection device, and the second inspection device, so that the first inspection device and the second inspection device respectively correspond to an object to be inspected placed on the carrier unit; wherein the microprocessor unit has a unit area pre-perforation detection operation logic for analyzing and calculating the image recognition generated by the object to be inspected placed on the carrier unit and generating pre-perforation discrimination information within a unit area that has not undergone a perforation process.

[0006] The glass substrate inspection system disclosed in the present invention utilizes the microprocessor unit's per-area pre-drilling detection logic, the first inspection device, and the second inspection device. This system significantly improves the reliability of subsequent processes for glass substrates that have not undergone a perforation process, unlike conventional microscope inspection methods used in prior art. Furthermore, if a pre-drilling process is detected, such as a failure to achieve pre-through in a specific process, it can be effectively detected by inspection personnel, significantly improving yield. Simple diagram description

[0007] FIG1 is a system architecture diagram of a preferred embodiment of the present invention, which mainly discloses a glass substrate inspection system suitable for glass substrates before a perforation process.

[0008] FIG2 is a three-dimensional schematic diagram of some components of the glass substrate inspection system disclosed in FIG1 , mainly illustrating a state where a glass substrate before a perforation process is not yet placed in front of the glass substrate inspection system.

[0009] FIG3 is a partial schematic perspective view similar to FIG2 , mainly showing a state where the glass substrate before the perforation process is placed on a carrying unit of the glass substrate inspection system.

[0010] FIG4 is a partial schematic perspective view of components similar to FIG3 , mainly showing a state where the glass substrate before the perforation process and the carrying unit have been pushed to a position to be inspected.

[0011] 5 is a partial perspective schematic diagram similar to FIG4 , mainly illustrating a state in which a first inspection device and a second inspection device of the glass substrate inspection system are moved downward and approach the top of the glass substrate before the perforation process.

[0012] FIG6 is a front view schematic diagram similar to FIG5 , mainly showing the inspection state of the first inspection device and the second inspection device of the glass substrate inspection system after being lifted and moved away from the glass substrate before the perforation process.

[0013] FIG7 is a schematic diagram illustrating the inspection status of the glass substrate inspection system disclosed in FIG6 after the first inspection device and the second inspection device capture a plurality of pre-perforation image data of a portion of the glass substrate before the perforation process, and after the micro-processing unit executes a unit area pre-perforation inspection operation logic. Implementation Method

[0014] The applicant first clarifies that throughout this specification, including the embodiments described below and the various claims in the patent application, directional terms are based on the directions of the various figures listed in the [Brief Description of the Figures] of this application. Furthermore, in the embodiments and figures described below, identical component numbers represent identical or similar components or structural features. Furthermore, the detailed structure, features, assembly, use, and manufacturing methods of the present invention will be described in the subsequent detailed description of the embodiments. However, those skilled in the art should understand that such detailed descriptions and the examples listed in the present invention are intended solely to illustrate how the present invention can be implemented and are not intended to limit the scope of the patent application.

[0015] Please refer to FIG. 1 and FIG. 2 , which illustrate a glass substrate inspection system 1A for inspecting a glass substrate 2A before a perforation process (Pre-TGV, Through Glass Via) according to a preferred embodiment of the present invention. The glass substrate inspection system 1A includes a microprocessor unit 10A, a carrier unit 20A, a first inspection device 30A, a second inspection device 40A, and a power supply module 50A. The microprocessor unit 10A, the first inspection device 30A, the second inspection device 40A, and the power supply module 50A are individually assembled on the carrier unit 20A. The microprocessor unit 10A is individually electrically connected and electrically controlled. The carrier unit 20A, the first inspection device 30A, and the second inspection device 40A are configured so that the first inspection device 30A and the second inspection device 40A are respectively configured to correspond to the object to be inspected placed on the carrier unit 20A, i.e., the glass substrate 2A after the perforation process in this embodiment. The power supply module 50A is respectively electrically connected to and supplies the power required by the microprocessor 10A, the carrier unit 20A, the first inspection device 30A, and the second inspection device 40A.

[0016] Please refer to FIG1 again. The microprocessing unit 10A has a pre-punching roundness calculation logic 11A and a unit area pre-punching detection calculation logic 15A. The unit area pre-punching detection calculation logic 15A is used to combine the pre-punching roundness calculation logic 11A with the image recognition calculation logic of the object to be tested placed on the carrier unit 20A to generate pre-punching discrimination information of the unit area without the punching process. It is worth mentioning that the microprocessing unit 10A of the preferred embodiment of the present invention has a pre-punching detection logic 11A. The pre-hole roundness calculation logic 11A of the processing unit 10A is defined by the radial offset of the laser-modified pre-hole profile relative to the ideal hole, that is, the difference between the maximum radius and the minimum radius relative to the same center of the circle. It is also worth mentioning that the unit area pre-hole detection calculation logic 15A of the micro-processing unit 10A of the preferred embodiment of the present invention includes but is not limited to the calculation logic using Fourier transform algorithm, sweep-line algorithm, kernel method or a combination thereof.

[0017] Please refer to Figures 1 to 5 together. The carrying unit 20A includes a plate-shaped carrier 21A, a carrier rail assembly 23A, and a support arm 25A that is substantially perpendicular and adjacent to the carrier rail assembly 23A. The plate-shaped carrier 21A has a light-transmissive top 212A and a bottom 213A corresponding to the top 212A. The top 212A of the carrier 21A is used to carry the glass substrate 2A after the perforation process. Preferably, the top 212A of the carrier 21A has a plurality of spaced-apart arrangements. The convex walls 214A of the carrier 21A allow the glass substrate 2A after the perforation process to be carried on the convex walls 214A. The bottom 213A of the carrier 21A is pivotally mounted on the carrier rail assembly 23A, so that the carrier 21A and the glass substrate 2A can slide back and forth according to the track direction of the carrier rail assembly 23A. In addition, the carrier 21A is embedded with a backlight module 215A and a backlight module polarizer 216A matching the backlight module 215A. Preferably, the backlight module 215A is closer to the bottom of the carrier 21A. 213A, the backlight module polarizer 216A is closer to the top 212A of the carrier 21A, and both transmit light in the direction of the top 212A of the carrier 21A; and the support arm 25A includes a first slide rail group 251A, a second slide rail group 253A and a base 255A, the first slide rail group 251A of the support arm 25A is arranged on the same side of the support arm 25A corresponding to the carrier slide rail group 23A, and the slide rail extension direction of the first slide rail group 251A is basically the same as the slide rail extension direction of the carrier slide rail group 23A. The second rail assembly 253A of the support arm 25A is pivotally mounted on the first rail assembly 251A, with the rails of the second rail assembly 253A extending in a direction substantially intersecting that of the first rail assembly 251A. The base 255A is pivotally mounted on the second rail assembly 253A and is capable of reciprocating sliding motion along the extension direction of the rails of the second rail assembly 253A. Preferably, the second rail assembly 253A and the base 255A are capable of reciprocating sliding motion along the extension direction of the rails of the first rail assembly 251A. It is worth noting that the adjustable light source generated by the backlight module 215A of the carrier 21A of the support unit 20A is 1,000 to 20,000 cd / m², while the adjustable light source generated by the backlight module polarizer 216A is 500 to 10,000 cd / m².

[0018] Please refer to Figures 1 to 5 again. The first detection device 30A and the second detection device 40A are respectively installed on the base 255A of the support arm 25A of the carrier unit 20A. In this way, the first detection device 30A and the second detection device 40A can slide back and forth according to the extension direction of the first slide rail assembly 251A of the support arm 25A of the carrier unit 20A, or can slide back and forth according to the extension direction of the second slide rail assembly 253A of the support arm 25A of the carrier unit 20A. The first detection device 30A includes a camera module 31A and a first detection polarizer 33A assembled with the camera module 31A. The camera module 31A and the first detection polarizer 33A are both electrically connected to and electrically controlled by the microprocessor unit 10A. In which, the camera module 31A and the first detection polarizer 33A are basically perpendicular and correspond to the direction of the carrier slide rail group 23A of the supporting unit 20A. Preferably, the first detection polarizer 33A is arranged in front of the lens of the camera module 31A; and the second detection device 40A includes a camera module 41A and a second detection polarizer 43A arranged in the camera module 41A, and the camera module 41A and the second detection polarizer 43A are both electrically connected and electrically controlled by the microprocessor unit 10A, wherein the camera module 41A and the second detection polarizer 43A are basically set at the same predetermined inclination angle with the direction of the carrier slide rail group 23A of the supporting unit 20A. Preferably, the second detection polarizer 43A is arranged in front of the lens of the camera module 41A. It is worth mentioning that the camera module 31A of the first detection device 30A and the camera module 41A of the second detection device 40A are basically composed of an industrial camera (models including but not limited to MBS2041POE [5m 5472 x 3648 pixels, 5.5fps], GigE [6M black and white 1 / 1.8" / 5m 3072 x 2048 pixels], etc.) and an industrial camera lens (models including but not limited to FA lens [LM12FC24M], 1X telecentric lens, etc.). The aforementioned technical features are all easily conceivable by those with ordinary knowledge in the relevant technical field after referring to the preferred embodiments of the present invention, or are merely simple replacement changes in model, quantity or size. Therefore, they are not intended to limit the technical features claimed by the present invention, and are therefore stated in advance.

[0019] The above describes the technical features of a glass substrate inspection system 1A and its various sub-components disclosed in a preferred embodiment of the present invention. The following will further describe how the glass substrate inspection system 1A is used to inspect glass substrates 2A that have not undergone a through-glass via (TGV) process, and the desired effects achieved are:

[0020] First, referring to Figures 1 to 4 , before the glass substrate inspection system 1A is about to perform an inspection, the microprocessor unit 10A of the glass substrate inspection system 1A first generates an initial signal and electrically transmits it to the carrier unit 20A, the first inspection device 30A, and the second inspection device 40A. This allows the carrier rail assembly 23A of the carrier unit 20A to propel the carrier 21A to a predetermined horizontal initial position away from the support arm 25A based on the initial signal. Furthermore, the first rail assembly 251A of the support arm 25A of the carrier unit 20A simultaneously lifts the second rail assembly 253A, the base 255A, the first inspection device 30A, and the second inspection device 40A to a predetermined vertical initial position away from the carrier rail assembly 23A based on the initial signal. This allows the inspection personnel to achieve a preliminary reset of the mechanism before conducting an inspection.

[0021] Secondly, please refer to FIG. 1 to FIG. 5, then, when the glass substrate 2A before the perforation process (Pre-TGV, Through Glass When the glass substrate 2A is stably placed on the ridges 214A of the top 212A of the carrier 21A of the carrier unit 20A, the microprocessor unit 10A of the glass substrate inspection system 1A generates a test signal and electrically transmits it to the carrier unit 20A, the first inspection device 30A, and the second inspection device 40A, respectively. In this way, the carrier rail assembly 23A of the carrier unit 20A can stably slide the carrier 21A, the backlight module 215A and the backlight module polarizer 216A embedded in the carrier 21A, and the glass substrate 2A placed on the ridges 214A of the carrier 21A from the predetermined horizontal initial position to a predetermined test position near the bottom of the support arm 25A according to the test signal. At the same time, the support arm 25A of the carrier unit 20A is also moved. The first slide rail assembly 251A is capable of lowering the second slide rail assembly 253A, the base 255A, the first inspection device 30A, and the second inspection device 40A from the predetermined vertical initial position to a predetermined height to be measured from the glass substrate 2A placed on the protrusions 214A of the stage 21A based on the signal to be measured. Preferably, the predetermined vertical distance to be measured between the first inspection polarizer 33A in front of the camera lens of the camera module 31A of the first inspection device 30A and the glass substrate 2A is between 10 mm and 220 mm, and the predetermined vertical distance to be measured between the second inspection polarizer 43A in front of the camera lens of the camera module 41A of the second inspection device 40A and the glass substrate 2A is between 10 mm and 220 mm, thereby achieving the effect of pre-inspection mechanism alignment calibration of the entire glass substrate inspection system 1A.

[0022] Third, please refer to Figures 1 to 7 together. When the microprocessor unit 10A of the glass substrate detection system 1A generates a glass substrate detection signal and transmits it electrically to the carrier unit 20A, the first detection device 30A, and the second detection device 40A, the first slide rail assembly 251A and the second slide rail assembly 253A of the support arm 25A of the carrier unit 20A both move the first detection device 30A again according to the glass substrate detection signal until the camera lens of the camera module 31A of the first detection device 30A and the first detection polarizer 33A arranged in front of the camera lens and the camera lens of the camera module 41A of the second detection device 40A are aligned. The vertical detection distance between the lens and the second detection polarizer 43A arranged in front of the camera lens and the glass substrate 2A is between 30 mm and 200 mm, wherein the camera lens of the camera module 41A of the second detection device 40A and the second detection polarizer 43A arranged in front of the camera lens form a predetermined detection angle between 20 degrees and 70 degrees with the glass substrate 2A. At this time, the camera lens of the camera module 31A of the first detection device 30A and the camera lens of the camera module 41A of the second detection device 40A respectively capture the plurality of pre-punched image data on the glass substrate 2A (in this embodiment, the data is basically The microprocessor 10A is configured to electrically transmit the pre-perforation roundness calculation logic 11A and the unit area pre-perforation detection calculation logic 15A to the microprocessor 10A so that the pre-perforation detection calculation logic 15A of the microprocessor 10A can perform logic operations based on the image data of the plurality of non-perforation processes on the glass substrate 2A captured by the camera module 31A of the first detection device 30A, the first detection polarizer 33A, and the camera module 41A and the second detection polarizer 43A of the second detection device 40A. After that, pre-drilling determination information of a unit area that has not undergone a perforation process (including but not limited to information related to any pre-drilling hole on the glass substrate 2A after the laser modification process) is generated and displayed by a display device electrically connected to an external device. As shown in FIG7 , for the local pre-drilling holes 2r, 2s, and 2t on the glass substrate 2A, the micro-processing unit 10A of the glass substrate inspection system 1A executes the pre-drilling roundness calculation logic 11A and the unit area pre-drilling detection calculation logic 15A to obtain the following related determination information: (a) the pre-drilling process is determined to be successful for the pre-drilling hole 2r; and (b) the pre-drilling process is determined to be unsuccessful for the pre-drilling holes 2s and 2t.In summary, the glass substrate inspection system 1A not only differs from prior art inspection methods by significantly improving the reliability of subsequent processes for glass substrates that have not undergone a perforation process, but also effectively enables inspection personnel to detect any issues, such as pre-perforations 2s and 2t, that have not completed pre-perforation in a specific process, thereby significantly improving yield.

[0023] Fourthly, please refer to FIG. 1 to FIG. 6 . Finally, when the glass substrate inspection system 1A completes the aforementioned inspection operations, the microprocessor unit 10A of the glass substrate inspection system 1A generates a reset signal and transmits it electrically to the carrier unit 20A, the first inspection device 30A, and the second inspection device 40A, respectively. In this way, the carrier rail assembly 23A of the carrier unit 20A can reset the carrier 21 according to the reset signal. A is pushed forward again to the predetermined horizontal initial position away from the support arm 25A, and the first slide rail group 251A of the support arm 25A of the supporting unit 20A will be able to lift the second slide rail group 253A, the base 255A, the first detection device 30A and the second detection device 40A to the predetermined vertical initial position away from the carrier slide rail group 23A according to the reset signal, thereby allowing the detection personnel to restore the mechanism after performing the detection action.

[0024] 1A: Glass substrate inspection system

[0025] 2A: Glass substrate

[0026] 10A: Microprocessor unit

[0027] 11A: Pre-punched roundness calculation logic

[0028] 15A: Unit area pre-punching detection logic

[0029] 20A: load-bearing unit

[0030] 21A: Stage

[0031] 212A: Top

[0032] 213A: bottom

[0033] 214A: convex wall

[0034] 215A: Backlight module

[0035] 216A: Backlight module polarizer

[0036] 23A: Carrier slide rail assembly

[0037] 25A: Support arm

[0038] 251A: First slide rail assembly

[0039] 253A: Second slide rail assembly

[0040] 255A: Base

[0041] 30A: First detection device

[0042] 31A: Camera module

[0043] 33A: First detection polarizer

[0044] 40A: Second detection device

[0045] 41A: Camera module

[0046] 43A: Second detection polarizer

[0047] 50A:Power supply module

[0048] 2r, 2s, 2t: pre-punched

Claims

1. A glass substrate inspection system, comprising: a microprocessor unit (10A), a carrier unit (20A), a first inspection device (30A), and a second inspection device (40A); wherein: The microprocessor unit (10A), the first detection device (30A) and the second detection device (40A) are respectively arranged in a group on the carrier unit (20A), and the carrier unit (20A) is provided with a backlight module (215A) and a backlight module polarizing plate (216A) matching the backlight module (215A); wherein the microprocessor unit (10A) is respectively electrically connected to and electrically controls the carrier unit (20A), the first detection device (30A) and the second detection device (40A), so that the first detection device (30A) and the second detection device (40A) are respectively electrically connected to and electrically controlled by the carrier unit (20A), the first detection device (30A) and the second detection device (40A). The second detection device (40A) corresponds to a test object placed on the carrier unit (20A); wherein the microprocessor unit (10A) has a pre-punching roundness calculation logic (11A) and a unit area pre-punching detection operation logic (15A), and the unit area pre-punching detection operation logic (15A) is used to combine and calculate the pre-punching roundness calculation logic (11A) and to analyze and calculate the image recognition generated by the test object placed on the carrier unit (20A) and generate pre-punching judgment information within a unit area that has not been punched.

2. The glass substrate inspection system of claim 1, wherein: The carrying unit (20A) comprises a plate-shaped carrier (21A), a carrier slide rail assembly (23A), and a support arm (25A) that is substantially vertical and adjacent to the carrier slide rail assembly (23A). The carrier (21A) is pivotally mounted on the carrier slide rail assembly (23A), so that the object to be measured placed on the carrier (21A) can slide back and forth according to the track direction of the carrier slide rail assembly (23A).

3. The glass substrate inspection system according to claim 2, wherein: The carrier (21A) of the carrying unit (20A) has a top (212A) and a bottom (213A) corresponding to the top (212A); wherein the top (212A) of the carrier (21A) is provided with a plurality of spaced-apart protrusions (214A) so that the object to be tested can be carried on the protrusions (214A); the bottom (213A) of the carrier (21A) is pivotally mounted on the carrier slide rail assembly (23A) so that the object to be tested placed on the carrier (21A) can slide back and forth according to the track direction of the carrier slide rail assembly (23A).

4. The glass substrate inspection system according to claim 3, wherein: The support arm (25A) of the carrying unit (20A) includes a first slide rail group (251A), a second slide rail group (253A) and a base (255A). The first slide rail group (251A) is arranged on the same side of the support arm (25A) corresponding to the carrier slide rail group (23A). The second slide rail group (253A) is pivoted on the first slide rail group (251A), and the slide rail extension direction of the second slide rail group (253A) is cross-arranged with the first slide rail group (251A). The base (255A) is pivoted on the second slide rail group (253A); wherein, the second slide rail group (253A) and the base (255A) can perform reciprocating sliding motion according to the track extension direction of the first slide rail group (251A).

5. The glass substrate inspection system according to claim 4, wherein: The first detection device (30A) and the second detection device (40A) are respectively installed on the base (255A) of the support arm (25A) of the carrying unit (20A).

6. The glass substrate inspection system according to claim 2, wherein: The support arm (25A) of the carrying unit (20A) includes a first slide rail group (251A), a second slide rail group (253A) and a base (255A). The first slide rail group (251A) is arranged on the same side of the support arm (25A) corresponding to the carrier slide rail group (23A). The second slide rail group (253A) is pivoted on the first slide rail group (251A), and the slide rail extension direction of the second slide rail group (253A) is cross-arranged with the first slide rail group (251A). The base (255A) is pivoted on the second slide rail group (253A); wherein, the second slide rail group (253A) and the base (255A) can perform reciprocating sliding motion according to the track extension direction of the first slide rail group (251A).

7. The glass substrate inspection system according to claim 6, wherein: The first detection device (30A) and the second detection device (40A) are respectively installed on the base (255A) of the support arm (25A) of the carrying unit (20A).

8. The glass substrate inspection system according to any one of claims 1 to 7, wherein: The pre-punching discrimination information of the unit area without the punching process generated by the unit area pre-punching detection calculation logic (15A) of the microprocessing unit (10A) combined with the pre-punching true roundness calculation logic (11A) includes the pre-punching state of any pre-punching hole after the laser modification process.

9. The glass substrate inspection system according to any one of claims 1 to 7, wherein: The first detection device (30A) includes a camera module (31A) and a first detection polarizer (33A) arranged in front of the camera module (31A), both of which are electrically connected and electrically controlled by the microprocessor unit (10A), and the camera module (31A) and the first detection polarizer (33A) are perpendicular to and correspond to the object to be tested placed on the carrier unit (20A).

10. The glass substrate inspection system according to any one of claims 1 to 7, wherein: The second detection device (40A) comprises a camera module (41A) and a second detection polarizer (43A) arranged in front of the camera module (41A), both of which are electrically connected and electrically controlled by the microprocessor unit (10A). The camera module (41A), the second detection polarizer (43A) and the object to be detected placed on the supporting unit (20A) are all arranged at a predetermined tilt angle in the same direction.

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