Wafer movement control method, apparatus, and system
TW202642980APending Publication Date: 2026-10-16SHENZHEN XINKAILAI IND MACHINERY CO LTD
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Patent Information
- Application Number
- TW115113356
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-02
- Filing Date
- 2026-04-02
- Publication Date
- 2026-10-16
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Figure TWG2TA001081371_001 
Figure TWG2TA001081371_002 
Figure TWG2TA001081371_003
Abstract
A wafer movement control method, apparatus, and system relate to the semiconductor manufacturing process. The wafer movement control method first acquires multiple position information corresponding to multiple overlapping patterns to ensure that the position of each overlapping pattern on the wafer can be accurately acquired. Based on the multiple position information, it determines the scanning mode with the shortest time between a first scanning mode and a second scanning mode, and then controls the wafer movement according to the shortest scanning mode.
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