Wafer cleaning fluid discharge structure

TW202642987APending Publication Date: 2026-10-16ACM RES (SHANGHAI) INC
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Patent Information

Application Number
TW114127822
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-31
Filing Date
2025-07-22
Publication Date
2026-10-16

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Abstract

This application provides a wafer cleaning fluid discharge structure, belonging to the field of semiconductor manufacturing. The wafer cleaning fluid discharge structure is disposed in a wafer cleaning chamber. The discharge structure includes: multiple annular guide shields, each annular guide shield including a shield body and an annular snap-fit ​​member extending vertically from the lower end of the shield body. Adjacent annular guide shields are connected by the annular snap-fit ​​member and form a guide channel for discharging cleaning fluid; a lifter for driving each annular guide shield to move up and down; wherein, each annular guide shield has a limiting part on the annular snap-fit ​​member, the limiting part being used to limit the adjacent annular guide shields.
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