Batch-type substrate processing apparatus and substrate processing method

Abstract

The present disclosure relates to a batch-type substrate processing apparatus and a substrate processing method, which are capable of adjusting a cooling rate and temperature distribution inside a process tube. The batch-type substrate processing apparatus includes a process tube, a cover part, a heater part, a refrigerant supply part configured to supply a cooling medium to a space between the cover part and the process tube, and a refrigerant discharge part configured to discharge the cooling medium from the space between the cover part and the process tube. The heater part includes a plurality of line heaters, the refrigerant supply part includes a plurality of injection ports provided to be spaced apart from each other in a spaced space between the plurality of line heaters, and the refrigerant discharge part includes a plurality of discharge ports, each of which is provided to be spaced apart from each of the plurality of injection ports in the spaced space between the plurality of line heaters.

Claims

1. A batch substrate processing apparatus, comprising: A process tube is configured to provide a process space in which a processing process is performed on a plurality of substrates disposed in multiple stages. A shield having an internal space for accommodating the process tube; a heating section disposed within the shield along a circumference of the process tube to supply heat to the process tube; a refrigerant supply section configured to supply a cooling medium to a space between the shield and the process tube; and a refrigerant discharge section configured to discharge the cooling medium from the space between the shield and the process tube, wherein the heating section includes a plurality of linear heaters spaced apart from each other and disposed in multiple stages; the refrigerant supply section includes a plurality of inlets spaced apart from each other in a space between the plurality of linear heaters; and the refrigerant discharge section includes a plurality of outlets, each of the plurality of outlets disposed in the space between the plurality of linear heaters and spaced apart from each of the plurality of inlets.

2. The batch substrate processing apparatus as claimed in claim 1, wherein the refrigerant supply section further includes a supply flow path disposed inside a side wall of the protective cover section to communicate with two or more of the plurality of injection ports, and the refrigerant discharge section further includes a discharge flow path spaced apart from the supply flow path to communicate with two or more of the plurality of discharge ports.

3. The batch substrate processing apparatus as claimed in claim 2, wherein the supply flow path and the discharge flow path extend along the circumference of the process tube, and the discharge flow path is disposed outside the supply flow path.

4. The batch substrate processing apparatus as claimed in claim 3, wherein the refrigerant discharge section further includes a plurality of connecting pipes passing through at least a portion of the supply flow path to connect each of the two or more discharge ports to the discharge flow path.

5. The batch substrate processing apparatus as described in claim 1, wherein the refrigerant supply section and the refrigerant discharge section are interchanged.

6. The batch substrate processing apparatus as claimed in claim 2, wherein the refrigerant supply section further includes an inlet conduit disposed outside the sidewall of the shroud to allow the cooling medium to be introduced into the supply flow path, and the refrigerant discharge section further includes an outlet conduit disposed outside the sidewall of the shroud to allow the cooling medium to be discharged from the discharge flow path.

7. The batch substrate processing apparatus as claimed in claim 6, wherein the heating unit further includes a terminal portion connected to each of the plurality of linear heaters.

8. The batch substrate processing apparatus as described in claim 7, wherein the inlet conduit and the outlet conduit are symmetrically disposed on both sides of the terminal portion.

9. The batch substrate processing apparatus as claimed in claim 8, wherein each of a virtual line connecting the center of the process tube to the inlet conduit and a virtual line connecting the center of the process tube to the outlet conduit has an angle of 35° to 55° relative to a virtual line connecting the center of the process tube to the terminal portion.

10. The batch substrate processing apparatus as claimed in claim 7, wherein the terminal portions are arranged in a plurality of stages, wherein each of the terminal portions is connected to each of a plurality of heater groups, each of the plurality of heater groups being configured by one or more linear heaters selected from the plurality of linear heaters.

11. The batch substrate processing apparatus as claimed in claim 6, wherein each of the supply flow path and the discharge flow path is provided in multiple stages, wherein the inlet conduit and the outlet conduit are provided in the multiple stages to correspond to the supply flow path and the discharge flow path, respectively.

12. The batch substrate processing apparatus as described in claim 7, further comprising a first device box and a second device box, the first device box and the second device box being arranged parallel to each other along a first direction in the process tube and spaced apart from each other in a second direction intersecting the first direction to define a maintenance area, wherein the terminal portion is provided to correspond to the maintenance area.

13. A substrate processing method, comprising: A processing process is performed on a plurality of substrates arranged in multiple stages inside a process tube. A cooling medium is supplied to a space between a shield having an internal space for accommodating a process tube and the process tube; and the cooling medium is discharged from the space between the shield and the process tube, wherein performing the processing includes heating the process tube by a heating unit.

14. The substrate processing method as claimed in claim 13, wherein the supply of the cooling medium overlaps at least partially with the performance of the processing procedure.

15. The substrate processing method as described in claim 13, wherein the supply of the cooling medium and the discharge of the cooling medium are continuously and repeatedly performed.

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