Interposer structure and manufacturing method thereof

TW202642993APending Publication Date: 2026-10-16KORE SEMICONDUCTOR INC
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Patent Information

Application Number
TW114117562
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-11
Filing Date
2025-05-09
Publication Date
2026-10-16

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Abstract

An interposer structure and manufacturing method thereof, in which a first circuit portion and a second circuit portion are respectively formed on opposite sides of an interposer body to balance the stress of the interposer structure, thereby avoiding the problem of warping in subsequent applications.
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