Semiconductor devices and manufacturing methods thereof

TW202642996APending Publication Date: 2026-10-16RAPIDUS CORP
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Patent Information

Application Number
TW114143752
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-08-22
Filing Date
2025-11-10
Publication Date
2026-10-16

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Abstract

The wiring substrate of this embodiment has a first through-hole wiring that extends through the thickness direction of the first insulating layer and along the second direction of the planar direction of the first insulating layer; and a second through-hole wiring that extends through the first direction of the second insulating layer provided on the first insulating layer and is connected to the first through-hole wiring, having a first end extending along the second direction and contacting the first through-hole wiring, and a second through-hole wiring with a cylindrical shape at the second end located on the opposite side of the first end in the first direction.
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