Package structure and method for manufacturing the same

TW202643001APending Publication Date: 2026-10-16NAT YANG MING CHIAO TUNG UNIV
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Patent Information

Application Number
TW114112297
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2026-10-16

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    Figure TWG2TA001079842_003
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Abstract

The present invention provides a package structure, which comprises: a substrate; a first Cu conductive element disposed on the substrate and having a first upper surface and two first side surfaces, wherein the two first side surfaces are opposite to each other and connected to the first upper surface respectively; and a first passivation layer formed on the first upper surface and the two first side surface of the first Cu conductive element, wherein the first passivation later comprises Cu 3Sn.
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