Electronic package, heat dissipation structure and manufacturing method thereof

TW202643002APending Publication Date: 2026-10-16SILICONWARE PRECISION IND CO LTD
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Patent Information

Application Number
TW114113016
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-04-07
Publication Date
2026-10-16

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Abstract

An electronic package and its heat dissipation structure and manufacturing method. The electronic package includes a carrier, an electronic component provided on the carrier, and a heat dissipation structure covering the electronic component. A Back Side Metallization is formed on the electronic component and a nanoporous metal layer is formed on the heat dissipation structure, so that when the heat dissipation structure is connected to the electronic component, the nanoporous metal layer is combined with the Back Side Metallization, thereby strengthening the combination of the heat dissipation structure and the electronic component, and improving the heat dissipation effect.
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