Semiconductor package module, semiconductor system and method for fabrication of the same

Abstract

A semiconductor package module, a semiconductor system and a method for fabrication of the same are provided. The semiconductor package module includes a circuit substrate, a metal substrate and a plurality of metal pillars. The circuit substrate includes a first opening, and the first opening is connected to two opposite sides of the circuit substrate. The metal substrate is disposed on a surface of the circuit substrate, while the metal substrate includes a second opening. The second opening is connected to two opposite sides of the metal substrate, and the second opening of the metal substrate does not overlap the first opening of the circuit substrate. The metal pillars are disposed on the surface of the circuit substrate and is located inside the second opening of the metal substrate

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