Semiconductor assembly having a warpage inhibitor in combination with a sealant

Abstract

A semiconductor assembly includes a warpage inhibitor, a semiconductor device, a sealant, and a wiring structure. The semiconductor device is electrically connected to the wiring structure and embedded in the sealant, which is combined with the warpage inhibitor to form a rigid–compliant reinforced composite configuration. The warpage inhibitor contains inorganic materials that have a suitably low coefficient of thermal expansion (CTE) and a suitably high elastic modulus to provide rigidity and reduce CTE-induced warpage between the sealant and a carrier by limiting the volume of sealant that has a CTE mismatch with the carrier.

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