Semiconductor chip and semiconductor package including substrate
TW202643013APending Publication Date: 2026-10-16SK HYNIX INC
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Patent Information
- Application Number
- TW115101383
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-10
- Filing Date
- 2026-01-14
- Publication Date
- 2026-10-16
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Figure TWG2TA001080939_001 
Figure TWG2TA001080939_002 
Figure TWG2TA001080939_003
Abstract
A semiconductor chip includes a first substrate having a first coefficient of thermal expansion. A circuit structure is disposed on the first substrate. A second substrate is disposed on the circuit structure. The second substrate has a second coefficient of thermal expansion in a range of
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