Copper (CU) interconnect methods and circuits

Abstract

A method of electrically connecting dice in at least one power module, the method comprising: forming a pattern of positive relief platforms in a layer of copper (Cu) bonded to an insulating substrate by etching the copper to a depth that exposes surface regions of the insulating substrate; etching blind cavities having floors in the platforms for receiving dice comprised in the at least one module, the dice having contact pads on top surfaces of the dice; electrically bonding the dice to the floors; and electrically plating Cu interconnects created by photolithography and electroplating process to electrically connect the dice.

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