Electronic package and manufacturing method thereof

TW202643021APending Publication Date: 2026-10-16SILICONWARE PRECISION IND CO LTD
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Patent Information

Application Number
TW114113784
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-04-11
Publication Date
2026-10-16

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Abstract

The present invention provides an electronic package and its manufacturing method. It mainly connects a first electronic component on a substrate, stacks a second electronic component on the first electronic component, wherein the second electronic component overhangs the first electronic component, and forms a strengthening layer on the second electronic component to enhance the bending resistance.
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