Encapsulation layer, lamination film and manufacturing method thereof; semiconductor device encapsulation method

TW202643026APending Publication Date: 2026-10-16WUHAN CHOICE TECHNOLOGY CO LTD
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Patent Information

Application Number
TW114113871
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-04-11
Publication Date
2026-10-16

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Abstract

The embodiment of the present invention provides an encapsulation layer, a lamination film, a manufacturing method thereof; as well as a semiconductor device encapsulation method. The encapsulation layer contains bonding region and bonding recognition region. The bonding recognition region adjoins the bonding region and protrudes relative to its edge. In the process of bonding encapsulation layer, the orientation function of bonding recognition region in encapsulation layer is used to improve bonding accuracy and yield of encapsulation layer.
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