Flexible antenna-in-package structure

Abstract

A flexible Antenna-in-Package (AiP) structure is proposed. The flexible AiP structure includes a substrate film, an antenna structure and a package body. The antenna structure is disposed in a first region of the substrate film. The package body is disposed in a second region of the substrate film. A first surface of the package body is electrically connected to the substrate film. The first region of the flexible substrate is bent toward a second surface of the package body, so that the antenna structure is overlapped on the second surface. The antenna structure is electrically connected to the package body through the second region and the first surface. Therefore, the present disclosure can not only achieve functions of transmitting and receiving, but also save the production cost and reduce the size of the structure.

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