Method of forming semiconductor package including semiconductor chips and related semiconductor package

Abstract

A method of forming a semiconductor package includes forming a carrier chip including a base chip, a silicon layer, and an adhesive layer between the base chip and the silicon layer. A core chip is stacked on a wafer including a top chip. The carrier chip is stacked on the core chip. An encapsulation layer is formed on the wafer to cover the core chip and the carrier chip. The silicon layer and the adhesive layer are removed. The encapsulation layer and the wafer are diced.

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