Probes for integrated circuit testing

Abstract

[Purpose of the Item]: This design is a probe for testing integrated circuits, primarily used to establish electrical contact between the electrodes (pads, balls, pins) on integrated circuit (IC) chips or packages and the test equipment. [Design Description]: Please refer to the views shown. This design is a 'probe for testing integrated circuits'. Its distinctive feature is that, viewed from a 3D perspective, it presents a majestic and towering visual aesthetic, resembling a layered, stacked mountain range, giving a sense of unattainable grandeur. The design fully showcases the aesthetic appeal of the creator's unique design concept. Viewed from the left and right sides, it resembles not only mountains but also towering staircases reaching into the clouds, with different levels interwoven to create a unique visual aesthetic. Furthermore, the left and right views also feature a subtle indentation at the bottom of the probe, adding a touch of modern style to the otherwise serious design. In summary, this design possesses a rich sense of layering, combining various geometric and three-dimensional elements to create a novel and unique product that embodies the creator's ingenious design concept. This design meets the requirements for a design patent application, and we respectfully request that the Bureau grant us the patent.

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