Adhesive tape for manufacturing semiconductor device

Abstract

[Item use] The adhesive tape for manufacturing semiconductor elements claimed in the present design is used in semiconductor manufacturing process. [Design description] The rear view is the view that the ordinary consumer will not pay attention to when selecting or using, so it is omitted. The dashed part disclosed in the drawing is not claimed in the design. The point chain line disclosed in the drawing is surrounded, which defines the scope claimed in the present application, and the point chain line itself is not claimed in the design.