Interconnect module assembly

TWD246397SActive Publication Date: 2026-09-01SAMTEC INC
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Patent Information

Application Number
TW113305142
Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Priority Date
2023-06-29
Filing Date
2023-08-07
Publication Date
2026-09-01
Estimated Expiration
2038-08-06

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Abstract

【Item Uses】 This case relates to an interconnect module component. 【Design Description】 From an overall perspective, the interconnect module components of this creation not only completely break away from the traditional design of existing products, but also have an exquisite and unique overall shape, with novel and distinctive visual effects and creativity. The dotted lines in the diagram represent the parts for which this design is not advocated; the area enclosed by a single chain line in the diagram defines the scope for which this design is to be asserted, and that single chain line itself represents the part for which this design is not advocated. The gray fill shown in the diagram is used to help present the outline of this design, and does not represent the grayscale color shown in the diagram. The scope of the design patent is as shown in the drawings.
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Citation Information

Patent Citations

  • Fixtures for electrical connectors

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