Semiconductor die bonder

Abstract

【Item Uses】 The item described herein relates to a semiconductor manufacturing die bonding machine, which is used to pick up semiconductor devices from a wafer and transfer them to a lead frame or substrate for mounting. 【Design Description】 The semiconductor manufacturing die bonding machine of this design has a manufacturing space inside, which can be used to transfer and install semiconductor components onto lead frames or substrates. The semiconductor manufacturing die bonding machine of this design has an openable and closable door for external access to the manufacturing space. In semiconductor manufacturing, the die bonding machine designed for semiconductor manufacturing is used with the door closed. The semiconductor manufacturing die bonding machine of this design is equipped with a display for showing the manufacturing conditions or manufacturing status of semiconductor manufacturing. The dotted lines shown in the diagram represent the parts that are not recommended for design in this case.

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