Vehicle

Abstract

【Item Uses】 The article used in this design is a carrier for holding objects such as multiple wafers, semiconductor wafers, and glass substrates. As shown in the reference perspective view, the article has a structure consisting of a superimposed "conductive substrate with a slightly circular plate shape" and an "insulating layer with a slightly circular plate shape." The conductive substrate and the insulating layer have approximately the same diameter. The thickness of the conductive substrate is greater than the thickness of the insulating layer. Multiple through-holes extending through the conductive substrate in the thickness direction are formed in the conductive substrate. The multiple through-holes are formed in the central region of the conductive substrate; in other words, the multiple through-holes are not formed in the radially outer peripheral region of the central region. Notches extending in the thickness direction are formed on the outer surfaces of the conductive substrate and the insulating layer. The article used in this design holds the object on the surface of the insulating layer by electrostatic attraction generated by applying a voltage to the conductive substrate. The article used in this design detaches the object held on the surface of the insulating layer by supplying gas to the through-holes of the conductive substrate. 【Design Description】 none.

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