Memory module

TWD246982SActive Publication Date: 2026-10-01AGITECHNOLOGYCO LTD
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Patent Information

Application Number
TW115300478
Authority / Receiving Office
TW · TW
Patent Type
Designs
Current Assignee / Owner
Filing Date
2026-01-30
Publication Date
2026-10-01
Estimated Expiration
2041-01-29

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  • Figure TWG2TB001914613_001
    Figure TWG2TB001914613_001
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    Figure TWG2TB001914613_002
  • Figure TWG2TB001914613_003
    Figure TWG2TB001914613_003
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Abstract

【Item Uses】 The item in this design is a memory module installed in a computer host. 【Design Description】 The distinctive feature of this design is its overall appearance, which is a geometric and linear combination of a top light guide and a heat sink. The surface of the heat sink has multiple sets of symmetrically arranged diagonal lines that extend from the central area to both sides, forming a radial arrangement. The overall visual presentation resembles a diamond-shaped totem structure, giving the appearance a three-dimensional and technological feel. The top light guide system adopts an irregular polyhedral shape with sharp edges and corners. Its surface is composed of multiple intersecting planes, forming a three-dimensional appearance with a geometric cut. It echoes the diagonal lines of the heat sink below, which is different from the appearance of traditional heat sink modules with smooth or single shapes. The dotted lines shown in the diagram (the exposed parts of the AGI trademark and circuit board) are the parts that this case does not advocate designing.
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Citation Information

Patent Citations

  • Memory module

    TWD169231S

  • Electronic device heat sink

    TWD224451S

  • Portion of heat sink for memory module

    TWD225439S